Job Description
Axon is seeking a Senior Firmware Engineer I to join their team in Ho Chi Minh City, Vietnam. This role is part of the Platform Firmware development team, contributing to AIoT Device-level Firmware Infrastructure and advancing Axon’s mission to Protect Life. The engineer will work on innovative product-line programs, synthesizing Axon’s technologies and core competencies.
Responsibilities: - Firmware Design and Development of AIoT infrastructure
- Develop Firmware for eLinux or eAndroid-based System-on-Chips (SoC) and/or System-on-Modules (SoM)
- Develop Firmware for Microcontrollers
- Develop Firmware for Wi-Fi, Bluetooth BLE, Sub-GHz, Cellular LTE & 5G, and related RF technologies
- Develop Firmware for Battery and Power Management sub-systems with a critical eye towards Safety and Thermal Performance
- Develop Manufacturing Software Provisioning and Calibration Tooling
- Develop Unit, Integration and Automated Tests and Test Equipment as part of the development process
- Support Electrical Engineering with Board Bring-up and Hardware Debugging Support
- Write and review Design Docs, Pull Requests, and contribute to the Team’s documentation bank
- Collaborate with distributed teams such as other Firmware Teams, Embedded Product Teams (i.e., Business Logic), Electrical Engineering, Manufacturing and Compliance
- Collaborate with System-on-Chip (SoC) and Cellular Modem vendors to optimize for AIoT use-cases and key performance parameters
- Drive Engineering Excellence and adopt a test and metrics-first mindset
- Be a Team Player, Mentor, Strong Communicator and be ready and willing to support the Team when needed
Requirements: - B.S. in Computer Engineering, Computer Science, Electrical Engineering or equivalent
- Experience in programming with C, C++, Rust, Golang and/or Python
- Real-world Industry Firmware or Embedded experience of 8-10 years developing on IoT products
- Experience with both Kernel and User-space Embedded Linux with exposure to Yocto, OpenWRT or other Embedded Distros for Board Support Packaging (BSP)
- Experience with Embedded Android Kernel and User-space (AOSP)
- Experience with RTOS on Microcontrollers
- Basic ability to read Datasheets and Schematics
- Experience with concise Technical Writing and Architecture Diagramming
- Strong understanding of Computer Architecture and Peripherals
- Strong understanding of Operating Systems, Concurrency and Networking concepts
- Strong understanding of Data Structures, Algorithms and Object Oriented Design Patterns
- Experience with Cellular LTE, 5G Modems is a strong plus
- Experience with Battery and Power Management sub-systems, Safety and Thermal, is a strong plus
- Experience with Robotics and/or 9-Axis Orientation Algorithms is a strong plus
Benefits: - Medical and Dental Insurance
- Vision Insurance
- Robust Paid Time Off policy
- Bonuses
- Lunch allowance
- Cell phone stipend
- Free LinkedIn Learning account
- Access to 24/7 online emotional and mental support
- Gym membership
- Free parking
- Stocked fridges and pantries - free coffee, cold beverages, snacks
- Annual Company Outing Trip
- Monthly team social activities